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PRODUCT SPECIFICATIONS
ROBUST 1.3-LITRE SLIM PC SUPPORTS INTEL CORE PROCES-
BAREBONE SORS WITH SOCKET LGA1700 AND FOUR UHD DISPLAYS
XPC slim
The Shuttle XPC slim Barebone DH670 with H670 chipset houses the performance of In-
tel's 12th/13th/14th generation**) Core desktop processors (codenamed Alder Lake-S and
DH670
Raptor Lake-S [Refresh]) for socket LGA1700 in a compact 1.3-litre format. The DH670 al-
lows for four Ultra HD displays to be operated at the same time via 2x HDMI and 2x Dis-
playPort. It also offers Dual Intel LAN, four USB 3.2 Gen 2 and COM ports. The slim metal
chassis comes with a VESA mount included, provides versatile connectivity and reliable
operation in environments with ambient temperatures of up to 50 °C. This platform is tar-
geted at professional applications such as Digital Signage, POS, POI, gambling machines,
office, healthcare and industry.
2x 32 GB 2x HDMI 2.0b 2x DISPLAY- QUAD NVMe SSD 2.5" HDD/SSD DUAL LAN DUAL COM VESA MOUNT WLAN / LTE Max. 24/7
SUPPORT PORT 1.4 4K UHD SUPPORT SUPPORT OPTIONAL 50 °C SUPPORT
SLIM DESIGN STORAGE – SATA / M.2
◼ Slim 1.35-litre metal chassis, black ◼ Dimensions: 190 x 165 x 43 mm ◼ 1x 2.5" bay for SATA hard disk or SSD ◼ 1x M.2-2280M slot (supports
(LWH) ◼ Including VESA mount (75/100 mm) ◼ Supports 24/7 Nonstop PCIe 4.0 x4 NVMe or SATA) ◼ 1x M.2-2230E for optional WLAN module
Operation ◼ Operating temperature: 0~50 °C (non-condensing)
CONNECTORS
OPERATING SYSTEM ◼ 2x HDMI 2.0b ◼ 2x DisplayPort 1.4 ◼ optional VGA ◼ SD card reader
◼ An operating system is not included ◼ 2x audio (line out, mic) ◼ 4x USB 3.2 Gen2 ◼ 4x USB 3.2 Gen1 (1x
◼ Supports Windows 10, Windows 11 and Linux (64-bit) Type-C) ◼ 2x Intel Gigabit LAN (RJ45) ◼ 2x COM port (1x
RS232/422/485) ◼ Connector for external power button ◼ "Always on"
PROCESSOR SUPPORT **) Jumper
◼ Socket LGA1700 supports Intel Core i9/i7/i5/i3, Pentium Gold und
Celeron processors Gen. 12/13/14 ("Alder Lake-S" and “Raptor Lake-S [Re- POWER SUPPLY
fresh]”), max. 65W TDP ◼ Includes heatpipe cooling system ◼ External 120W/19V power adapter
GRAPHICS OPTIONAL ACCESSORIES
◼ Integrated Intel HD graphics, 4K support (features depend on proces- ◼ WLAN Module (WLN-M (ac)/WLN-M1 (ax)) ◼ Vertical Stand (PS02)
sor) ◼ Supports four independent UHD displays ◼ VGA Port (PVG01) ◼ Rackmount kit (PRM01) ◼ Cable for external
power button (CXP01) ◼ DIN-Rail mounting kit (DIR01) ◼ LTE-kit
CHIPSET (WWN03)
◼ Intel H670 Chipset
MEMORY SUPPORT
◼ 2x 260-pin SO-DIMM slot ◼ Supports DDR4-3200/2666/2400
◼ max. 2x 32 GB
MODELS OF THE DH6xx SERIES
Product Chip HDMI DP Displays LAN (Intel) M.2-2280 Slot COM Card reader DC-In VESA Mount UPC Code
DH610S H610 1 1 max. 2 *) 1G PCIe v3.0 X4 — — 19V — 887993005126
DH610 H610 1 2 max. 3 1G+2.5G PCIe v3.0 X4 2 — 12V + 19V included 887993005119
DH670 H670 2 2 max. 4 2x 1G PCIe v4.0 X4 2 Yes 19V included 887993004983
DH670V2 H670 2 2 max. 4 2x 2.5G PCIe v4.0 X4 2 — 19V included 887993005942
*) max. 3 displays with optional VGA port (accessory PVG01)
**) Important note: for Intel Core processors of the generation 13 and 14 (Raptor Lake-S [Refresh]) a BIOS update might be necessary, that
need to be performed with a compatible processor. Generation 13 is supported since BIOS version 205 (available since March'23 and Genera-
tion 14 is supported since BIOS version 210 (available since Jan'24).
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PRODUCT SPECIFICATIONS
PRODUCT FEATURES
1.3 L Robust, stylish and particu- thermore, the DH670 supports an op-
tional D-Sub/VGA port. The PC sup-
16.5 cm larly small ports a maximum of four displays.
19 cm
You should have held it in your own
hands to see how small it actually is. One M.2-Slot for SSD cards
At barely a volume of 1.35 litres, its The M.2-2280 slot supports one M.2
steel chassis gives it the appropriate SSD storage card with NVMe PCIe 4.0
stability required for professional ap- X4 or SATA interface. Type 2280
Only 4.3 cm tall
plications such as digital signage. De- means, it supports the usual M.2
spite its dimensions of 19 x 16.5 x 4.3 cards with a width of 22 mm and a
cm (LWH), the overall system perfor- length of 80 mm, but also 2242 and
mance is very high thanks to support 2260 standard cards are supported.
of Intel Core desktop processors. The
interior of the DH670 is very tidy too
so that it won't take long to set up. Its
Dual Intel Gigabit LAN Network
The Shuttle XPC slim Barebone
sleek and stylish looks let it easily
DH670 supports Dual Gigabit LAN
find a place in both home and office
with Intel network adapters, which
environments.
are popular for their excellent perfor-
mance and driver compatibility and
Low noise thanks to heatpipe are the preferred choice for profes-
sional environments.
cooling system
An active dual-fan heatpipe cooling
system ensures whisper-quiet opera- VESA mount
tion and system stability. The supplied 75/100mm VESA mount
allows for installation on to walls or
monitors which is particularly inter-
esting for the industry segment, com-
pany buildings and public institutions.
Supports extended tempera- Other than this, the chassis bears nu-
ture range and 24/7 operation merous threaded holes (M3) enabling
The Shuttle XPC slim Barebone it to be fitted almost anywhere.
DH670 is officially approved for 24/7
permanent operation. Thanks to its
efficient cooling, this PC runs highly Power on after Power fail
reliably making it perfectly suitable The BIOS setup provides a "Power-On
for digital signage and POI/POS appli- after Power Fail" function that can be
cations - even at ambient tempera- found under "Power Management
tures of up to 50 °C (non-condensing). Configuration". As the name indi-
Caution: For high ambient tempera- cates, this function determines the
tures over 40 °C we strongly recom- PC's behaviour after power failure: (1)
mend to use SSDs. unconditional power on, (2) restore
former status (3) keep system turned
off (4) Power-On by LAN or (5) Power-
Supports Socket LGA1700 On by Real-Time-Clock. As a matter of
Intel® Core™ processors *) the nature of this function, it may fail
"Alder Lake-S" / “Raptor Lake-S (Re- after short power failures. This is why
fresh)” is the codename for Intel's the DH670 also comes with a hard-
12th/13th/14th Generation of Intel® ware-based solution. By removing
Core™ Desktop Processors for socket Jumper JP2 (see image) the system
LGA1700 introduced along with the will start unconditionally once power
600/700-Series chipsets. The is applied.
12000/13000/14000 series proces-
sors feature a new hybrid design External power button by sepa-
combining a number of performance
cores (P-cores) and efficiency cores rate remote line
(E-cores). Get the performance you If, because of space constraints (e.g.
need, where you need it – whether in case of fixed installation), the ma-
you’re a gamer, creator, streamer, or chine cannot be switched on by
everyday user. pressing the front power button, it
*) BIOS-Update might be required to can be powered on by a separate re-
support Gen13/14 processors mote line. You will find an appropriate
four-pin connector at the back panel
of the DH670 (pitch 2.54 mm). Fur-
Quad 4K Display support thermore, this connector provides a
The DH670 features four digital video Clear CMOS function and +5V DC volt-
outputs: two HDMI 2.0b and two Dis- age supply for external devices.
playPorts (DP 1.4) which all can run at +5V voltage (2) (4) Power Button
4K (3840 x 2160 / 2160p) high resolu- Clear CMOS (1) (3) Ground
tion at 60 Hz frames per second. Fur-
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PRODUCT SPECIFICATIONS
Front and Back Panel
Front panel
. Microphone input
. Headphones output
. LED indicator for power state
. LED indicator for storage activity
. Power button
. SD card reader
. x USB . Gen port ( x Type-C)
. x USB . Gen port
. x WLAN perforation
Back panel . COM port supports RS /RS /RS
. COM port supports RS
(or optional VGA port for analog displays)
. DC-in connector for power adapter
. x HDMI . b port
. x DisplayPort .
. x RJ Gigabit LAN port
. x USB . Gen port
. x USB . Gen port
. -pin connector ( . mm pitch)
for external power button, Clear CMOS button
Right side and V DC voltage
Front
Rear
. Threaded holes (M )
Left side . x hole for Kensington Lock
Front
Rear
. VESA mount (two parts)
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PRODUCT SPECIFICATIONS
Mainboard Back panel
Back view
Front view
Front panel
. -pin connector ( . mm pitch) for external power button, . Intel H chipset with heat sink
Clear CMOS button and V DC voltage . Onboard VGA connector
. x USB . Gen port ( x Type-C) . x SO-DIMM memory slot
. x USB . Gen port . LGA processor socket
. RJ Gigabit LAN port . Audio connector (optional)
. RJ Gigabit LAN port . SATA v . connector
. x DisplayPort . . -pin connector for cooling fan
. HDMI . a port . Always-Power-On jumper
. DC-in connector for power adapter . Microphone input
. Connector for CMOS battery . Headphones output
. Onboard USB . connector ( -pin) . LED indicator for power state
. M. - M slot for SSD card . LED indicator for storage activity
. M - E slot for WLAN card . Power button
. Jumper for COM / auxiliary voltage setting ( / / V) . SD card reader
. Onboard COM port supports RS /RS /RS . x USB . Gen port
. Onboard COM port supports RS . x USB . Gen port
. Debug header (reserved)
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PRODUCT SPECIFICATIONS
REQUIRED COMPONENTS
The following components need to be added to make it a fully-configured Mini PC
LGA1700 Processor
Intel Core Gen 12/13/14 “Alder Lake-S” or “Raptor Lake-S
[Refresh]” Core i9 / i7 / i5 / i3, Pentium Gold or Celeron
TDP max. 65 W
*) a BIOS-Update might be required to support
Gen13/14 processors
Memory Modules
Up to two DDR4-3200/2666/2400
SO-DIMM memory modules
Shuttle XPC slim Barebone DH670 max. 32 GB each
2.5" Storage Drive
SATA hard disk or Solid State Disk (SSD)
(max. height: 12.5 mm)
M.2 SSD (optional)
M.2-2280/2260/2242
SSD storage (SATA or PCIe/NVMe)
Operating System
Windows 10/11 or Linux (64-bit only)
OPTIONAL ACCESSORIES FROM SHUTTLE
VGA port adapter PVG01
Installing PVG01 means one
serial port (COM) less can be Vertical Stand PS02
used on the backpanel. for vertical operation
WLAN-Accessory
WLN-M (802.11ac / Wifi 5)
WLN-M1 (802.11ax / Wifi 6)
M.2-2230 card supports DIN-Rail Kit DIR01
WLAN and Bluetooth This mounting kit allows the in-
including 2 antennas stallation on a standard 35
mm DIN-Rail
LTE Adapter Kit WWN03
allows the installation of an
M.2 LTE card and nano SIM Rack Mount Kit PRM01
card 2U front plate to install two
(occupies the 2.5” bay) 1.3L Shuttle XPCs in a 19" cabi-
net.
Cable CXP01
Cable for external push button
switch (without button)
Shuttle Product Comparison: DH4xx versus DH6xx
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PRODUCT SPECIFICATIONS
MODEL DH410S DH410(C) DH470(C) DH610S DH610 DH670(V2)
PROCESSOR Intel Core, Sockel LGA1200, TDP max. 65 W Intel Core, Sockel LGA1700, TDP max. 65 W
SUPPORT Codename "Comet Lake-S" – Gen 10 Codename "Alder Lake-S"/”Raptor Lake-S” – Gen 12/13/14 **)
CHIPSET Intel H410 Intel H410 Intel H470 Intel H610 Intel H610 Intel H670
OS SUPPORT Windows 10/11 and Linux (64-bit) Windows 10/11 and Linux (64-bit)
MULTI-DISPLAY max. 2 max. 2 max. 3 max. 2 **) max. 3 max. 4
RAM MEMORY max. 2x 32 GB DDR4-2933/2666 SO-DIMM max. 2x 32 GB DDR4-3200/2666 SO-DIMM
2.5" BAY 1x 2.5" drive bay, SATA connector, max. height 12.5 mm 1x 2.5" drive bay, SATA connector, max. height 12.5 mm
supports PCIe 3.0 supports PCIe 3.0 supports PCIe 4.0
M.2-2280 SSD SLOT M.22280M supports PCIe 3.0 x4 or SATA
x4 or SATA x4 or SATA x4 or SATA
WLAN SLOT M.2-2230E M.2-2230E
BUTTONS / LEDS Power-Button, Power LED, HDD LED Power-Button, Power LED, HDD LED
SD CARD READER Yes, but not with DH410C and DH470C No No Yes, DH670 only
HDMI 1.4b HDMI 2.0a HDMI 2.0a HDMI 2.0b HDMI 2.0b 2x HDMI 2.0b
GRAPHICS PORTS
DP 1.2 DP 1.2 2x DP 1.2 DP 1.4 2x DP 1.4 2x DP 1.4
USB 3.2 GEN. 2 — — 4 — — 4
USB 3.2 GEN. 1 4 (1x Type-C) 4 4 (1x Type-C) 4 (1x Type-C) 4 (1x Type-C) 4 (1x Type-C)
USB 2.0 4 4 — 4 4 —
COM PORTS — 2 2 — 2 2
Dual LAN Dual LAN
Single LAN Dual LAN Dual LAN Single LAN
GIGABIT NETWORK Intel 225 (2.5G) 2x i210/211 (1G)
Realtek 8111H (1G) 2x Intel 210 (1G) 2x Intel 210 (1G) Intel 219V/LM (1G)
Intel 219V/LM (1G) DH670V2: 2x 2.5G
AUDIO Mic-Input, Line-Out (Realtek ALC662) Mic-Input, Line-Out (Realtek ALC662/897/888S)
WLAN Kit: WLN-M/WLN-M1 WLAN Kit: WLN-M/WLN-M1
Vertical Stand: PS02 Vertical Stand: PS02
Rackmount Kit: PRM01 Rackmount Kit: PRM01
OPTIONAL
VGA Port: PVG01 VGA Port: PVG01
ACCESSORIES
Power Button Cable: CXP01 Power Button Cable: CXP01
DIN-Rail Mount: DIR01 DIN-Rail Mount: DIR01
LTE-Kit: WWN03 LTE-Kit: WWN03
VESA MOUNT optional PV04 supplied supplied optional PV04 supplied supplied
POWER ADAPTER 90 W / 19 V 120 W / 19 V
DC-IN 12V SUPP. — Yes — — Yes —
Product Images
DH410* DH410S / DH610 / DH610S DH470 / DH670 (DH670V2 without Card Reader)
DH410S DH410 DH470
DH610S DH610 DH670(V2)
*) The DH410C and DH470C have no Card Reader. **) The DH610S supports 3 displays, if equipped with VGA port (accessory PVG01)
**) Important note for Shuttle XPCs of the DH6xx/XH61x series: for Intel Core processors of the generation 13/14 (Raptor Lake-S [Refresh]) a BIOS update might be necessary,
that need to be performed with a compatible processor.
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PRODUCT SPECIFICATIONS
SHUTTLE XPC SLIM BAREBONE DH670 — SPECIFICATIONS
Slim PC with black chassis made of metal
Dimensions: 190 x 165 x 43 mm (LWH) = 1.35-litre
CHASSIS Weight: 1.3 kg net and 2.1 kg gross
Two holes for Kensington Locks and numerous
threaded holes (M3) on both sides of the chassis
External 120 W power adapter (fanless)
Input: 100~240 V AC, 50/60 Hz
Output: 19 V DC, 6.32 A, max. 120 W
POWER ADAPTER DC Connector: 5.5/2.5 mm (outer/inner diameter)
Remark: The DC-input of the computer supports an external power source with 19V±5%.
AC mains cable: 3 pins, ca. 1.7 m length, with C5/C6 coupler (called "Mickey Mouse" or "Clover-leaf") for the power
adapter and CEE-7/7 plug with earth-contact (type E+F) for the power outlet
This system comes without an operating system.
OPERATING SYSTEM
It is compatible with Windows 10/11 and Linux (64-bit).
Processor Socket LGA1700
Supports Intel Core i9 / i7 / i5 / i3, Pentium Gold and Celeron processors
Supports the following generations of Intel Core processors:
- Gen 12 "Alder Lake-S"
- Gen 13 "Raptor Lake-S" since BIOS-Version 205 available since Mar'23 *)
- Gen 14 "Raptor Lake-S Refresh" since BIOS-Version 210 available since Jan'24 *)
in "Intel 7" process technology (previously Intel 10 nm Enhanced SuperFin)
PROCESSOR SUPPORT
Supports processors with integrated graphics only [5]
Maximum supported processor power consumption (TDP) = 65 W
Does not support the unlock-function of Intel K-Series processors.
The processor integrates PCI-Express, memory controller
and the graphics engine on the same die.
* Attention: in case an BIOS update is required, the PC must first be started with a compatible processor.
Download-Website: https://global.shuttle.com/support/download
PROCESSOR COOLING Heatpipe processor cooling with two 60 mm fans on the upper side of the chassis
Mainboard in a Shuttle form factor proprietary design for the XPC DH670
Chipset/Southbridge: Intel® H670
MAINBOARD / CHIPSET Passive chipset cooling with heat sink
The Northbridge is integrated in the processor.
Solid Capacitors for sensitive areas provide excellent heat resistance for enhanced system durability.
AMI BIOS, SPI Interface, 16 MB Flash-EPROOM
Supports Hardware Monitoring and watch dog functionality
Supports Firmware-TPM (fTPM) v2.0 [9]
BIOS
Supports boot up from external USB flash memory
Supports Unified Extensible Firmware Interface (UEFI)
Supports power on after power failure [7]
2x SO-DIMM slot with 260 pins
Supports DDR4-3200/2933/2666/2400/2133 (PC4-25600/23466/21300/19200/17000) SDRAM at 1.2 V
Supports Dual Channel mode
MEMORY SUPPORT
Supports a maximum of 32 GB per DIMM,
maximum total size: 64 GB
Supports two unbuffered DIMM modules (no ECC or registered)
The features of the integrated Intel UHD graphics function
depend on the processor type used. [10]
The PC features four video outputs which support 1080p/60 and 2160p/60:
- 2x HDMI v2.0b
INTEGRATED GRAPHICS - 2x DisplayPort v1.4
Supports displays with 4K Ultra HD resolution at 3840 x 2160
Supports four independent displays with the integrated graphics function
DisplayPort and HDMI support multi-channel digital audio over the same cable.
Optional analog D-Sub/VGA video output [4]
1x 6.35 cm / 2.5" storage bay supports one hard disk or SSD drive with SATA connector
DRIVE BAY
Device height: 12.5 mm (max.)
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PRODUCT SPECIFICATIONS
1x Serial-ATA III, 6 Gb/s (600 MB/s) bandwidth
SATA CONNECTORS
With Serial-ATA power connector (onboard)
The M.2 2280M slot provides the following interfaces:
- PCI-Express Gen. 4.0 X4, supports NVMe
M.2-2280M - SATA v3.0 (max. 6 Gbps)
SSD SLOT It supports M.2 cards with a width of 22 mm
and a length of 42, 60 or 80 mm (type 2242, 2260, 2280).
Supports M.2 SSDs with SATA or PCI-Express interface
Interfaces: PCI-Express Gen. 2.0 X1 und USB 2.0
M.2-2230E SLOT FOR Supports M.2 cards with a width of 22 mm and a length of 30 mm (type 2230)
WLAN CARDS
Supports WLAN expansion cards (optional Shuttle accessory: WLN-M/M1)
Audio Realtek® ALC 897/662/888S High-Definition Audio
Two analog audio connectors (3.5 mm) on the front panel:
AUDIO 1) 2-channel line-out (headphones)
2) microphone input
Digital multi-channel audio output: by HDMI and DisplayPort
Dual network with two RJ45 ports with two status LEDs each
Used network chips:
2x Intel i210/i211 Ethernet Controller (MAC, PHY)
DUAL GIGABIT LAN PCIe interface
CONTROLLER Supports Windows 10 Desktop OS and Windows Server OS
Supports 10 / 100 / 1.000 MBit/s operation
Supports WAKE ON LAN (WOL)
Supports network boot by Preboot eXecution Environment (PXE)
Integrated card reader
Supports SD, SDHC and SDXC up to v3.01 memory flash cards
CARD READER
UHS-I interface supports up to 104 MB/s (SDR104) transfer speed
PCIe chipset interface
Microphone input
Audio Line-out (headphones)
2x USB 3.2 Gen 2 Type A (red)
1x USB 3.2 Gen 1 Type A (blue)
FRONT PANEL
1x USB 3.2 Gen 1 Type C
CONNECTORS
SD card reader
Power button
Power LED (blue)
HDD LED (yellow)
2x HDMI 2.0b connector [1]
2x DisplayPort 1.4 connector (DP) [2]
Optional: 1x D-Sub VGA connector (Accessory PVG01 [4])
2x USB 3.2 Gen 2 Type A (red)
2x USB 3.2 Gen 1 Type A (blue)
2x Gigabit LAN (RJ45)
BACK PANEL 2x RS232 serial port, 9-pin D-Sub (5/12V, 1x RS422/RS485) [3]
CONNECTORS 1x DC-input connector for external power adapter (supports 19V±5%)
1x 4-pin connector (2.54 mm pitch) supports:
- external power on button
- Clear CMOS function
- +5V DC voltage for external components
2x perforation for optional Wireless LAN antennas
2x hole for Kensington Lock
1x jumper for power-on-after-power-fail (hardware solution) [7]
1x analog VGA graphics output CN6 (2x 10-pin, 1 mm pitch) [4]
OTHER ONBOARD 2x serial interface (COM) occupied by back panel connectors
CONNECTORS 1x USB 2.0 (4-pin) for optional accessory WWN03 (LTE kit)
1x fan connector (4-pin) occupied by the cooling system
1x connector for CMOS battery (occupied)
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PRODUCT SPECIFICATIONS
Multi-language user guide (EN, DE, FR, ES, JP, KR, SC, TC)
VESA mount for 75/100 mm standard (two metal brackets)
Four screws M3 x 5 mm (screws together VESA mount and PC)
Four screws M4 x 10 mm (to affix VESA mount on the PC)
Four screws M3 x 4 mm (to mount a 2.5" storage device into the bay)
SUPPLIED
Two screws M3 x 5 mm (silver colour, to mount two M.2 cards)
ACCESSORIES
Driver DVD (Windows 64-bit)
Serial ATA cable for 2.5" drive including power cable
External 120 W power adapter with power cord
Protection cap for CPU socket (do not use if heatpipe or fan is mounted)
Heatsink compound
PVG01: optional D-Sub VGA video output [4]
WLN-M/WLN-M1: WLAN module in M.2-2230 format supports WLAN and Bluetooth with two external antennas.
WWN03: LTE adapter kit with antennas, but without LTE card
OPTIONAL
PS02: Stand for vertical operation
ACCESSORIES
CXP01: adapter cable for external power button
PRM01: 2U rack mount front plate for two Shuttle XPC slim PCs
DIR01: DIN-Rail mounting kit
ENVIRONMENTAL Operating temperature range: 0~50 °C [6]
SPECIFICATIONS Relative humidity, non-condensing: 10~90 %
EMI: FCC, CE, BSMI, RCM, VCCI
CERTIFICATIONS /
Safety: ETL, CB, BSMI
COMPLIANCE
Other: RoHS, Energy Star, ErP
This device is classed as a technical information equipment (ITE) in class B and is intended for use in living room
and office. The CE-mark approves the conformity by the EU directives:
CONFORMITY (1) 2004/108/EC relating to electromagnetic compatibility (EMC),
(2) 2006/95/EC relating to Electrical Equipment designed for use within certain voltage limits (LVD),
(3) 2009/125/EC relating to ecodesign requirements for energy-related products (ErP)
[1] HDMI output supports DVI-D with optional adapter
[2] How to convert DisplayPort into HDMI/DVI
The DisplayPort output can be converted to HDMI or DVI by an additional, passive adapter cable. For example:
DELOCK 82590: 1 m, DisplayPort (male, 20p) to HDMI-A (male, 19p)
DELOCK 82435: 5 m, DisplayPort (male, 20p) to DVI-D (male, 24p)
The integrated graphics automatically detects the connected display and puts out the appropriate electric signal - either through DisplayPort (without an adapter)
or HDMI/DVI (with an adapter).
However, a monitor with a DisplayPort connector cannot be connected to the HDMI port with a simple, passive adapter.
[3] Serial Ports
This PC features two serial RS232 ports with 9-pin D-Sub connectors at the back panel. The left COM port (COM1) can also be configured as RS422 and RS485 in
BIOS.
Pin 9 of the D-Sub COM-Port is a multi-functional signal. Based on the Jumper JP1 configuration on the mainboard, it can be configured as Ring Indicator (RI) or
external power supply with a voltage level of either 5 V or 12 V. Each COM port can be configured separately. The maximum current is 500 mA per connector.
[4] Optional D-Sub/VGA connector
The mainboard features one analog graphics port CN6 on the mainboard. This signal can be lead to the outside as a 15-pin D-Sub VGA connector on the backpanel
by using the optional adapter PVG01. However doing so means one serial port (COM) less can be used on the backpanel. The integrated graphics supports a maxi-
mum of four displays simultaneously.
[5] Intel processors without integrated graphics (ID ends with "F", e.g. Core i7-12700F) are not compatible.
[6] Operating temperature
For high ambient temperatures over 40 °C we strongly recommend to use SSDs (supporting at least 70 °C) and rugged SO-DIMM memory modules with a tempera-
ture range of up to 95 °C.
[7] Power on after power fail
The BIOS setup provides a "Power-On after Power Fail" function that can be found under "Power Management Configuration". As the name indicates, this function
determines the PC's behaviour after power failure: (1) unconditional power on, (2) restore former status or (3) keep system turned off. As a matter of the nature of
this function, it may fail after short power failures. This is why the DH670 also comes with a hardware-based solution. By removing Jumper JP2 (on the mainboard
behind the power button) the system will start unconditionally once power is supplied.
[8] Optional Accessory WWN03 (LTE kit)
The Shuttle XPC accessory WWN03 allows this PC to be upgraded with an LTE/4G function for mobile network. The LTE card will occupy the 2.5" bay, so you will
have to use an M.2 SSD as a mass storage device. The required LTE/4G card in M.2-3042 format and an activated Nano SIM card is not included in the scope of
delivery.
[9] TPM Function
This product features Firmware-TPM (fTPM) v2.0. Besides this, it is prepared for a hardware TPM chip which can be fitted by factory on request, if required.
Shuttle Computer Handels GmbH · Fritz-Strassmann-Str. 5 · 25337 Elmshorn · Germany
Tel. +49 (0) 4121-47 68 60 · Fax +49 (0) 4121-47 69 00 · sales@shuttle.eu 9 | 12 WWW. SH UT TL E. E U
PRODUCT SPECIFICATIONS
12TH GENERATION INTEL CORE DESKTOP PROCESSOR FAMILY
Socket LGA1700 10 nm "Alder Lake S” processor overview (Date: January 2022)
Processors with a TDP of more than 65W and processors without graphics function (ID ends with “F”) are not supported (marked in red).
P-CORES/ P-CORES E-CORES SMART BASE MEMORY GRAPHICS ENGINE
PROCESSOR MODEL E-CORES
THREADS CLOCK/Turbo CLOCK/Turbo CACHE TDP SUPPORT (MAX. CLOCK)
12900K 8 / 16 3.2 – 5.1 GHz 8 2.4 – 3.9 GHz 30 MB 125 W DDR4-3200 UHD 770 (1.55 GHz)
12900KF 8 / 16 3.2 – 5.1 GHz 8 2.4 – 3.9 GHz 30 MB 125 W DDR4-3200 None
Core™ i9 12900 8 / 16 2.4 – 5.0 GHz 8 1.8 – 3.8 GHz 30 MB 65 W DDR4-3200 UHD 770 (1.55 GHz)
12900F 8 / 16 2.4 – 5.0 GHz 8 1.8 – 3.8 GHz 30 MB 65 W DDR4-3200 None
12900T 8 / 16 1.4 – 4.8 GHz 8 1.0 – 3.6 GHz 30 MB 35 W DDR4-3200 UHD 770 (1.55 GHz)
12700K 8 / 16 3.6 – 4.9 GHz 4 2.7 – 3.8 GHz 25 MB 125 W DDR4-3200 UHD 770 (1.50 GHz)
12700KF 8 / 16 3.6 – 4.9 GHz 4 2.7 – 3.8 GHz 25 MB 125 W DDR4-3200 None
Core™ i7 12700 8 / 16 2.1 – 4.9 GHz 4 1.6 – 3.6 GHz 25 MB 65 W DDR4-3200 UHD 770 (1.50 GHz)
12700F 8 / 16 2.1 – 4.9 GHz 4 1.6 – 3.6 GHz 25 MB 65 W DDR4-3200 None
12700T 8 / 16 1.4 – 4.6 GHz 4 1.0 – 3.4 GHz 25 MB 35 W DDR4-3200 UHD 770 (1.50 GHz)
12600K 6 / 12 3.7 – 4.9 GHz 4 2.8 – 3.6 GHz 20 MB 125 W DDR4-3200 UHD 770 (1.45 GHz)
12600KF 6 / 12 3.7 – 4.9 GHz 4 2.8 – 3.6 GHz 20 MB 125 W DDR4-3200 None
12600 6 / 12 3.3 – 4.8 GHz – – 18 MB 65 W DDR4-3200 UHD 770 (1.45 GHz)
12600T 6 / 12 2.1 – 4.6 GHz – – 18 MB 35 W DDR4-3200 UHD 770 (1.45 GHz)
Core™ i5 12500 6 / 12 3.0 – 4.6 GHz – – 18 MB 65 W DDR4-3200 UHD 770 (1.45 GHz)
12500T 6 / 12 2.0 – 4.4 GHz – – 18 MB 35 W DDR4-3200 UHD 770 (1.45 GHz)
12400 6 / 12 2.5 – 4.4 GHz – – 18 MB 65 W DDR4-3200 UHD 730 (1.45 GHz)
12400F 6 / 12 2.5 – 4.4 GHz – – 18 MB 65 W DDR4-3200 None
12400T 6 / 12 1.8 – 4.2 GHz – – 18 MB 35 W DDR4-3200 UHD 730 (1.45 GHz)
12300 4/8 3.5 – 4.4 GHz – – 12 MB 60 W DDR4-3200 UHD 730 (1.45 GHz)
12300T 4/8 2.3 – 4.2 GHz – – 12 MB 35 W DDR4-3200 UHD 730 (1.45 GHz)
Core™ i3 12100 4/8 3.3 – 4.3 GHz – – 12 MB 60 W DDR4-3200 UHD 730 (1.45 GHz)
12100F 4/8 3.3 – 4.3 GHz – – 12 MB 58 W DDR4-3200 None
12100T 4/8 2.2 – 4.1 GHz – – 12 MB 35 W DDR4-3200 UHD 730 (1.40 GHz)
Pentium® G7400 2/4 3.7 GHz – – 6 MB 46 W DDR4-3200 UHD 710 (1.35 GHz)
Gold G7400T 2/4 3.1 GHz – – 6 MB 35 W DDR4-3200 UHD 710 (1.35 GHz)
G6900 2/2 3.4 GHz – – 4 MB 46 W DDR4-3200 UHD 710 (1.30 GHz)
Celeron®
G6900T 2/2 2.8 GHz – – 4 MB 35 W DDR4-3200 UHD 710 (1.30 GHz)
K = unlocked, T = Power optimized lifestyle, F = without integrated graphics, Base TDP = Base Thermal Design Power (max. Base Power Consumption).
Note: The Shuttle XPC slim Barebone DH670 does not support the Unlock-function of Intel K-Series processors.
P-Cores: Performance-Cores, E-Cores: Efficient-Cores
Core Clock: the listed core frequency ranges from Base Frequncy to Turbo Frequency (Turbo Boost 3.0 Frequency is not mentioned here)
Base TDF: Processor Base Power dissipation that the processor is validated to not exceed at Base Frequency (Max. Turbo Power is not mentioned here)
Please refer to the support list for detailed processor support information at global.shuttle.com.
Shuttle Computer Handels GmbH · Fritz-Strassmann-Str. 5 · 25337 Elmshorn · Germany
Tel. +49 (0) 4121-47 68 60 · Fax +49 (0) 4121-47 69 00 · sales@shuttle.eu 10 | 12 WWW. SH UT TL E. E U
PRODUCT SPECIFICATIONS
13TH GENERATION INTEL CORE DESKTOP PROCESSOR FAMILY
Socket LGA1700, Intel 7 / 10 nm, "Raptor Lake S” processor overview (Date: January 2023)
Processors with a TDP of more than 65W and processors without graphics function (ID ends with “F”) are not supported (marked in red).
Important note: for Intel Core processors of the generation 13 (“Raptor Lake-S”) and generation 14 (“Raptor Lake-S Refresh”) a BIOS up-date
might be necessary, that need to be performed with a compatible processor.
- Generation 13 is supported since BIOS version 205 (available since March'23 and
- Generation 14 is supported since BIOS version 210 (available since Jan'24).
Download-Website: https://global.shuttle.com/support/download.
P-CORES/ P-CORES E-CORES SMART BASE MEMORY GRAPHICS ENGINE
PROCESSOR MODEL E-CORES
THREADS CLOCK/Turbo CLOCK/Turbo CACHE TDP SUPPORT (MAX. CLOCK)
13900KS 8 / 16 3.2 – 6.0 GHz 16 2.4 – 4.3 GHz 36 MB 150 W DDR4-3200 UHD 770 (1.65 GHz)
13900K 8 / 16 3.0 – 5.8 GHz 16 2.0 – 4.3 GHz 36 MB 125 W DDR4-3200 UHD 770 (1.65 GHz)
13900KF 8 / 16 3.0 – 5.8 GHz 16 2.0 – 4.3 GHz 36 MB 125 W DDR4-3200 None
Core™ i9
13900 8 / 16 2.0 – 5.2 GHz 16 1.5 – 4.2 GHz 36 MB 65 W DDR4-3200 UHD 770 (1.65 GHz)
13900F 8 / 16 2.0 – 5.2 GHz 16 1.5 – 4.2 GHz 36 MB 65 W DDR4-3200 None
13900T 8 / 16 1.1 – 5.1 GHz 16 0.8 – 3.9 GHz 36 MB 35 W DDR4-3200 UHD 770 (1.65 GHz)
13700K 8 / 16 3.4 – 5.4 GHz 8 2.5 – 4.2 GHz 30 MB 125 W DDR4-3200 UHD 770 (1.60 GHz)
13700KF 8 / 16 3.4 – 5.4 GHz 8 2.5 – 4.2 GHz 30 MB 125 W DDR4-3200 None
Core™ i7 13700 8 / 16 2.1 – 5.1 GHz 8 1.5 – 4.1 GHz 30 MB 65 W DDR4-3200 UHD 770 (1.60 GHz)
13700F 8 / 16 2.1 – 5.1 GHz 8 1.5 – 4.1 GHz 30 MB 65 W DDR4-3200 None
13700T 8 / 16 1.4 – 4.8 GHz 8 1.0 – 3.6 GHz 30 MB 35 W DDR4-3200 UHD 770 (1.60 GHz)
13600K 6 / 12 3.5 – 5.1 GHz 8 2.6 – 3.9 GHz 20 MB 125 W DDR4-3200 UHD 770 (1.50 GHz)
13600KF 6 / 12 3.5 – 5.1 GHz 8 2.6 – 3.9 GHz 20 MB 125 W DDR4-3200 None
13600 6 / 12 2.7 – 5.0 GHz 8 2.0 – 3.7 GHz 24 MB 65 W DDR4-3200 UHD 770 (1.55 GHz)
13600T 6 / 12 1.8 – 4.8 GHz 8 1.3 – 3.4 GHz 24 MB 35 W DDR4-3200 UHD 770 (1.55 GHz)
Core™ i5 13500 6 / 12 2.5 – 4.8 GHz 8 1.8 – 3.5 GHz 24 MB 65 W DDR4-3200 UHD 770 (1.55 GHz)
13500T 6 / 12 1.6 – 4.6 GHz 8 1.2 – 3.2 GHz 24 MB 35 W DDR4-3200 UHD 770 (1.55 GHz)
13400 6 / 12 2.5 – 4.6 GHz 4 1.8 – 3.3 GHz 20 MB 65 W DDR4-3200 UHD 730 (1.55 GHz)
13400F 6 / 12 2.5 – 4.6 GHz 4 1.8 – 3.3 GHz 20 MB 65 W DDR4-3200 None
13400T 6 / 12 1.3 – 4.4 GHz 4 1.0 – 3.0 GHz 20 MB 35 W DDR4-3200 UHD 730 (1.55 GHz)
13100 4/8 3.4 – 4.5 GHz – – 12 MB 60 W DDR4-3200 UHD 730 (1.50 GHz)
Core™ i3 13100F 4/8 3.4 – 4.5 GHz – – 12 MB 58 W DDR4-3200 None
13100T 4/8 2.5 – 4.2 GHz – – 12 MB 35 W DDR4-3200 UHD 730 (1.50 GHz)
K = unlocked, T = Power optimized lifestyle, F = without integrated graphics, Base TDP = Base Thermal Design Power (max. Base Power Consumption).
Note: The Shuttle XPC slim Barebone DH670 does not support the Unlock-function of Intel K-Series processors.
P-Cores: Performance-Cores, E-Cores: Efficient-Cores
Core Clock: the listed core frequency ranges from Base Frequncy to Turbo Frequency (Turbo Boost 3.0 Frequency is not mentioned here)
Base TDF: Processor Base Power dissipation that the processor is validated to not exceed at Base Frequency (Max. Turbo Power is not mentioned here)
Please refer to the support list for detailed processor support information at global.shuttle.com.
Shuttle Computer Handels GmbH · Fritz-Strassmann-Str. 5 · 25337 Elmshorn · Germany
Tel. +49 (0) 4121-47 68 60 · Fax +49 (0) 4121-47 69 00 · sales@shuttle.eu 11 | 12 WWW. SH UT TL E. E U
PRODUCT SPECIFICATIONS
14TH GENERATION INTEL CORE DESKTOP PROCESSOR FAMILY
Socket LGA1700, Intel 7 / 10 nm, "Raptor Lake S Refresh” processor overview (Date: January 2024)
Processors with a TDP of more than 65W and processors without graphics function (ID ends with “F”) are not supported (marked in red).
Important note: for Intel Core processors of the generation 13 (“Raptor Lake-S”) and generation 14 (“Raptor Lake-S Refresh”) a BIOS up-date
might be necessary, that need to be performed with a compatible processor.
- Generation 13 is supported since BIOS version 205 (available since March'23 and
- Generation 14 is supported since BIOS version 210 (available since Jan'24).
Download-Website: https://global.shuttle.com/support/download.
P-CORES/ P-CORES E-CORES SMART BASE MEMORY GRAPHICS ENGINE
PROCESSOR MODEL E-CORES
THREADS CLOCK/Turbo CLOCK/Turbo CACHE TDP SUPPORT (MAX. CLOCK)
14900K 8 / 16 3.2 – 5.6 GHz 16 2.4 – 4.4 GHz 36 MB 125 W DDR4-3200 UHD 770 (1.65 GHz)
14900KF 8 / 16 3.2 – 5.6 GHz 16 2.4 – 4.4 GHz 36 MB 125 W DDR4-3200 None
Core™ i9 14900 8 / 16 2.0 – 5.4 GHz 16 1.5 – 4.3 GHz 36 MB 65 W DDR4-3200 UHD 770 (1.65 GHz)
14900F 8 / 16 2.0 – 5.4 GHz 16 1.5 – 4.3 GHz 36 MB 65 W DDR4-3200 None
14900T 8 / 16 1.1 – 5.1 GHz 16 0.8 – 4.0 GHz 36 MB 35 W DDR4-3200 UHD 770 (1.65 GHz)
14700K 8 / 16 3.4 – 5.6 GHz 8 2.5 – 4.3 GHz 33 MB 125 W DDR4-3200 UHD 770 (1.60 GHz)
14700KF 8 / 16 3.4 – 5.6 GHz 8 2.5 – 4.3 GHz 33 MB 125 W DDR4-3200 None
Core™ i7 14700 8 / 16 2.1 – 5.3 GHz 8 1.5 – 4.2 GHz 33 MB 65 W DDR4-3200 UHD 770 (1.60 GHz)
14700F 8 / 16 2.1 – 5.4 GHz 8 1.5 – 4.2 GHz 33 MB 65 W DDR4-3200 None
14700T 8 / 16 1.3 – 5.0 GHz 8 0.9 – 3.7 GHz 33 MB 35 W DDR4-3200 UHD 770 (1.60 GHz)
14600K 6 / 12 3.5 – 5.3 GHz 8 2.6 – 4.0 GHz 24 MB 125 W DDR4-3200 UHD 770 (1.50 GHz)
14600KF 6 / 12 3.5 – 5.3 GHz 8 2.6 – 4.0 GHz 24 MB 125 W DDR4-3200 None
14600 6 / 12 2.7 – 5.2 GHz 8 2.0 – 3.9 GHz 24 MB 65 W DDR4-3200 UHD 770 (1.55 GHz)
14600T 6 / 12 1.8 – 5.1 GHz 8 1.3 – 3.6 GHz 24 MB 35 W DDR4-3200 UHD 770 (1.55 GHz)
Core™ i5 14500 6 / 12 2.6 – 5.0 GHz 8 1.9 – 3.7 GHz 24 MB 65 W DDR4-3200 UHD 770 (1.55 GHz)
14500T 6 / 12 1.7 – 4.8 GHz 8 1.2 – 3.4 GHz 24 MB 35 W DDR4-3200 UHD 770 (1.55 GHz)
14400 6 / 12 2.5 – 4.7 GHz 4 1.8 – 3.5 GHz 20 MB 65 W DDR4-3200 UHD 730 (1.55 GHz)
14400F 6 / 12 2.5 – 4.7 GHz 4 1.8 – 3.5 GHz 20 MB 65 W DDR4-3200 None
14400T 6 / 12 1.5 – 4.5 GHz 4 1.1 – 3.2 GHz 20 MB 35 W DDR4-3200 UHD 730 (1.55 GHz)
14100 4/8 3.5 – 4.7 GHz – – 12 MB 60 W DDR4-3200 UHD 730 (1.50 GHz)
Core™ i3 14100F 4/8 3.5 – 4.7 GHz – – 12 MB 58 W DDR4-3200 None
14100T 4/8 2.7 – 4.4 GHz – – 12 MB 35 W DDR4-3200 UHD 730 (1.50 GHz)
K = unlocked, T = Power optimized lifestyle, F = without integrated graphics, Base TDP = Base Thermal Design Power (max. Base Power Consumption).
Note: The Shuttle XPC slim Barebone DH670 does not support the Unlock-function of Intel K-Series processors.
P-Cores: Performance-Cores, E-Cores: Efficient-Cores
Core Clock: the listed core frequency ranges from Base Frequncy to Turbo Frequency (Turbo Boost 3.0 Frequency is not mentioned here)
Base TDF: Processor Base Power dissipation that the processor is validated to not exceed at Base Frequency (Max. Turbo Power is not mentioned here)
Please refer to the support list for detailed processor support information at global.shuttle.com.
© 2024 Shuttle® Computer Handels-GmbH — All information subject to change without notice. Optional components and accessories are not included. Pictures for illustration purposes only.
Shuttle Computer Handels GmbH · Fritz-Strassmann-Str. 5 · 25337 Elmshorn · Germany
Tel. +49 (0) 4121-47 68 60 · Fax +49 (0) 4121-47 69 00 · sales@shuttle.eu 12 | 12 WWW. SH UT TL E. E U
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